Post-fab services for small silicon batches
We turn bare silicon into boards you can work with, from your first prototype to a small production batch.
What we do
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Known-good die sourcing
Sourcing off-the-shelf parts as bare die. From one wafer and up.
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Wafer dicing and division
Backgrinding, dicing and division into waffle pack.
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Chip-on-board wire bonding
Gold thermosonic and aluminum wedge bonding. Colourless or black epoxy glob-top.
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Testing
Checks for open connections and shorts, with coverage and reporting agreed for your job.
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Packing and shipping
Kitting, assembly and fulfillment. Ship to you, your customers or your fulfillment partner.
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Crowd Supply launch support
Launch on Crowd Supply. Run the campaign and handle every detail.
Understanding your yield
We can check for broken bonds and shorts before investigating the chip design.
We agree the assembly requirements, test coverage and reporting before production, so you know what has been checked. Click here to see our testing methods and reporting.
Who we work with
Open-silicon designers
You have die from wafer.space, Tiny Tapeout or a university shuttle, and need them prepared for a board or prototype.
Startups
You are taking a first chip to demo hardware, and a packaging house wants a minimum order you cannot justify.
Research groups
You need a documented small batch for a research project.
We proudly work with
Tiny Tapeout
A shared path from small designs to real chips. Community involvement.
wafer.space
An open path from custom designs to real chips. Practical programme support.
resources
- PCB design for chip-on-boardPad geometry, clearance, panels, and what to avoid.
- Electrical testingTest coverage, method and reporting.
- Preparing and shipping your dieFormats, packing, paperwork and the route to Shenzhen.
- GlossaryCOB, glob-top, KGD, wedge and ball bonding.
Quick answers
What is the minimum quantity?
There is no minimum order quantity, but setup and non-recurring engineering costs should be taken into account. Unit costs come down from 500 units and above, quoted as a separate line item.
How long does it take?
We give you a date in the quote, once we have your die, your board design and the bonding diagram.
What do you need from me?
Die with a quantity and format, a pad coordinate table or die layout with pin 1 marked, a bonding diagram, and either your board or a request to use our template. If you want testing, include the expected readings too. Contact us to find out more. Contact us to find out more.
Do you do gold wire?
Yes. Aluminium is the default because it suits the aluminium pads on GF180MCU die but we can also do gold the thermosonic bonding.
Where are you?
We are based in Shenzhen, run by Europeans.
What does it cost?
It depends on die size, pad count, quantity, wire and agreed test coverage. Send us your requirements for a detailed quote.