What we do
We coordinate processing, testing, packing and partner services for small batches.
If columns are out of view, scroll horizontally
| Service | What it is |
|---|---|
| Chip-on-board bonding | Bare die glued and wire-bonded onto your board, hard epoxy glob-top. |
| Testing | Electrical testing with job specific coverage and reporting. |
| Wafer dicing and division | Backgrinding, dicing, and division into waffle pack. |
| Kitting and fulfilment | Finished board QC, packing, kitting and shipping. |
| Known-good die | Sourcing requested bare die where suppliers offer them. |
| Crowd Supply launch support | Pre-launch communication, campaign setup and management, production and delivery support. |
One point of contact, partners behind it
you own the spec
We work with you to specify what is bonded and what testing is required. The quote records the agreed scope, including test coverage and reports when requested.
Partners do the processing
We mainly work with trusted partners in Shenzhen, but our network expands across Asia to meet specific needs. We take full responsibility for the results.