Resources for die processing

Design guidance, testing information and practical steps for preparing a small die batch.

The guides

PCB design for chip-on-boardThe full design guide: pad geometry, clearance, die attach pad, panel rules, finish. If you read one page, read this.
Electrical testingTest coverage, method and reporting.
Preparing and shipping dieFormats, packing, paperwork, customs and delivery back.
GlossaryCOB, glob-top, KGD, wedge and ball bonding, panel, working edge, fiducial.